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Shenzhen Senyan Circuit Co., Ltd.
4 Years
| Ask Lasest Price | |
| Brand Name : | SenYan |
| Model Number : | 1 layer pcb |
| Certification : | ISO14001,ISO13485,ISO9001,IATF16949 |
| Price : | Negotiate |
| Payment Terms : | L/C, D/A, D/P, T/T |
| Supply Ability : | 100000pcs |
| Delivery Time : | 1-30days |
SENYAN offers pcb productiong services from 1-20 layer rigid
circuit board,
1-4 layer flexible pcb board. 1-2layer aluminum PCB
The materials includes standard FR4,FR1,CEM-1,
CEM-3, hight TG, Aluminum , FPC,polyimide, Teflon and so on.
| Product Line Name | Production Line Capacity | Actual Units Produced(Previous Year) |
|---|---|---|
| PCBA, PCB | PCB: 10000 m2 Per Month ;PCBA: 100000 m2 Per Month | PCB: 10000 m2 ;PCBA: 20000 m2 |
| Products Name | Order(in the last 12month) | Shortest Lead Time |
|---|---|---|
| PCB | 1 m2 | 2 Days |
| PCBA | 1 m2 | 5 Days |
SMT Manufacturing Capability | |||
Item | Manufacturing Capability in process | Manufacturing Method | |
| Production size(Min/Max) | 50×50mm / 500×500mm | ||
| Production board thickness | 0.2 ～ 4mm | ||
Printing solder paste | Support method | Magnetism fixture, vacuo platform | |
| Clamping method | Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board | ||
| Cleaning Method of printing solder paste | Dry method+ wetting method+ Vacuo method | ||
| Accuracy of printing | ±0.025mm | ||
| SPI | Repeated accuracy of volume | <1% at 3σ | |
Mounting component | Components size | 0603(Option) L75mm Connector | |
| Pitch | 0.15mm | ||
| Repeated accuracy | ±0.01mm | ||
AOI | FOV size | 61×45mm | |
| Test speed | 9150mm²/Sec | ||
| 3D X-ray | Shootingangle | 0-45 | |
Rigid PCB Manufacturing Capability | ||
Item | RPCB | HDI |
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) |
| minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) |
| minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) |
| maximum aspect Ratio (thickness/hole diameter) | 10:1 | 8:1 |
impedance control accuracy | +/-8% | +/-8% |
| finished thickness | 0.3-3.2MM | 0.2-3.2MM |
| maximum board size | 630MM*620MM | 620MM*544MM |
| maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) |
| minimum board thickness | 6MIL(0.15MM) | 3MIL(0.076MM) |
| maximum layer | 14 | 12 |
| Surface treatment | HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag | Immersion Gold,OSP,selectiveimmersion gold, carbon print |
| Min/max laser hole size | / | 3MIL / 9.8MIL |
| laser hole size tolerance | / | 10% |
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